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B3L30LP
Document number: DS30915 Rev. 11 - 2
2 of 5
www.diodes.com
March 2014
? Diodes Incorporated
B3L30LP
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30 V
RMS Reverse Voltage
VR(RMS)
21 V
Average Rectified Output Current
IO
3.0 A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
30 A
Thermal Characteristics
Characteristic Symbol Typ Max Unit
Thermal Resistance Junction to Soldering Point
RθJS
?
3
°C/W
Thermal Resistance Junction to Ambient Air (Note 5)
RθJA
130
?
°C/W
Power Dissipation
(Note 6)
(Note 7)
(Note 8)
PD
?
?
?
2.5
4.0
4.5
W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 9)
V(BR)R
30
?
?
V
IR
= 5.0mA
Forward Voltage
VF
?
0.28
?
V
IF
= 0.5A, T
J
= +25°C
?
0.30 0.35
IF
= 1.0A, T
J
= +25°C
?
0.18 0.29
IF
= 1.0A, T
J
= +125°C
?
0.33 0.40
IF
= 2.0A, T
J
= +25°C
?
0.22 0.37
IF
= 2.0A, T
J
= +125°C
?
0.35 0.45
IF
= 3.0A, T
J
= +25°C
?
0.26 0.42
IF
= 3.0A, T
J
= +125°C
Reverse Current (Note 9)
IR
?
0.27 1.0 mA TJ
= +25°C, V
R
= 30V
?
55 90 mA TJ
= +100°C, V
R
= 30V
Notes: 5. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com. TA
= +25°C.
2
pad area.
2
pad area.
2.
6. Device mounted on FR-4 PCB, 25mm
7. Device mounted on FR-4 PCB, 75mm
8. Aluminum PCB with copper mounting pad area of 75mm
9. Short duration pulse test used to minimize self-heating effect.
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